Advanced
OSAT
Operating a world-class Cleanroom for high-precision wafer probing, back-grinding, and advanced wire bonding, ensuring exceptional quality in high-assurance silicon packaging globally.
Wafer Testing (Probing)
Automated electrical testing and defect mapping for 200mm and 300mm wafers using high-precision probe stations.
Back-Grinding & Dicing
Mechanical and laser dicing solutions for ultra-thin wafers, essential for high-density smart card integration.
Wire Bonding & Assembly
Advanced gold and copper wire bonding for high-assurance elements within our high-precision Cleanroom environment.
Reliability & QA
Reliability stress testing and complex failure analysis for mission-critical silicon.
Technical Excellence
Strategic Integration of
Silicon Assembly
Our state-of-the-art OSAT facilities enable strategic technical independence by providing the critical back-end manufacturing steps required to transform raw silicon wafers into customised high-assurance elements globally.
Get ahead with us
Contact us to discuss wafer probing, back-grinding, or specialised wire-bonding requirements for your high-assurance element projects.