Capabilities
Outsourced Semiconductor Assembly and Testing (OSAT)
Operating a precision Cleanroom for high-precision wafer probing, back-grinding, and advanced wire bonding, ensuring exceptional quality in high-assurance silicon packaging.
Smart Card Manufacturing
High-volume production of the complete spectrum of high-assurance cards, including SIM, NB-IoT, ATM, and biometric National Identity programmes.
High-Assurance Identity Solutions
End-to-end development of high-assurance identity frameworks, cryptographic applets, and high-assurance data personalisation for national registries.
End-to-End
Manufacturing
Authority
From semiconductor design and testing to high-speed high-assurance card embedding, ASMC operates as an integrated technical value chain serving global markets.
Semiconductor
Packaging & Assembly
Our high-precision Cleanroom facility is optimised for the OSAT market, bridging the gap between silicon design and final product deployment.
Wafer Testing (Probing)
Automated electrical testing and defect mapping for 200mm and 300mm wafers using high-precision probe stations.
Back-Grinding & Dicing
Mechanical and laser dicing solutions for ultra-thin wafers, essential for high-density smart card integration.
Wire Bonding & Packaging
Advanced gold and copper wire bonding for high-assurance elements within our precision Cleanroom environment.
Quality Assurance (QA)
Reliability stress testing (HTOL, HAST) and complex failure analysis for mission-critical silicon.
Card Body Lamination
Large-scale PC/PVC card body production with focus on physical assurance and durability.
Chip Module Embedding
High-speed automated embedding of dual-interface (DI) modules into precision-milled card bodies.
High-Assurance Personalisation
High-volume electrical data encoding and high-assurance laser engraving for identity and payment cards.
OS & Applet Management
Development and loading of Java Card OS profiles, custom applets, and remote file management (RFM).
Smart Card
Manufacturing
Our high-volume production facility delivers high-assurance identity and payment cards at scale, with an annual capacity of over 200 million cards.
Mastering Technical
Precision
Every stage of the value chain is managed within a high-assurance framework. We have a Quality Assurance (QA) Lab that ensures all silicon and smart card products are in compliance with international reliability standards.
Hardware Assurance
Integrated physical tamper detection in all high-assurance element packaging.
Industrial Power
Reserve power systems and high-assurance data backups for zero-downtime manufacturing.
Leverage Our Infrastructure
ASMC is your technical partner for semiconductor assembly and large-scale high-assurance card production.